DRAMCtrl.py revision 11120:eef83ecab5bf
1# Copyright (c) 2012-2014 ARM Limited 2# All rights reserved. 3# 4# The license below extends only to copyright in the software and shall 5# not be construed as granting a license to any other intellectual 6# property including but not limited to intellectual property relating 7# to a hardware implementation of the functionality of the software 8# licensed hereunder. You may use the software subject to the license 9# terms below provided that you ensure that this notice is replicated 10# unmodified and in its entirety in all distributions of the software, 11# modified or unmodified, in source code or in binary form. 12# 13# Copyright (c) 2013 Amin Farmahini-Farahani 14# Copyright (c) 2015 University of Kaiserslautern 15# All rights reserved. 16# 17# Redistribution and use in source and binary forms, with or without 18# modification, are permitted provided that the following conditions are 19# met: redistributions of source code must retain the above copyright 20# notice, this list of conditions and the following disclaimer; 21# redistributions in binary form must reproduce the above copyright 22# notice, this list of conditions and the following disclaimer in the 23# documentation and/or other materials provided with the distribution; 24# neither the name of the copyright holders nor the names of its 25# contributors may be used to endorse or promote products derived from 26# this software without specific prior written permission. 27# 28# THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT HOLDERS AND CONTRIBUTORS 29# "AS IS" AND ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT 30# LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR 31# A PARTICULAR PURPOSE ARE DISCLAIMED. IN NO EVENT SHALL THE COPYRIGHT 32# OWNER OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, 33# SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT 34# LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, 35# DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY 36# THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT 37# (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE 38# OF THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. 39# 40# Authors: Andreas Hansson 41# Ani Udipi 42# Omar Naji 43# Matthias Jung 44 45from m5.params import * 46from AbstractMemory import * 47 48# Enum for memory scheduling algorithms, currently First-Come 49# First-Served and a First-Row Hit then First-Come First-Served 50class MemSched(Enum): vals = ['fcfs', 'frfcfs'] 51 52# Enum for the address mapping. With Ch, Ra, Ba, Ro and Co denoting 53# channel, rank, bank, row and column, respectively, and going from 54# MSB to LSB. Available are RoRaBaChCo and RoRaBaCoCh, that are 55# suitable for an open-page policy, optimising for sequential accesses 56# hitting in the open row. For a closed-page policy, RoCoRaBaCh 57# maximises parallelism. 58class AddrMap(Enum): vals = ['RoRaBaChCo', 'RoRaBaCoCh', 'RoCoRaBaCh'] 59 60# Enum for the page policy, either open, open_adaptive, close, or 61# close_adaptive. 62class PageManage(Enum): vals = ['open', 'open_adaptive', 'close', 63 'close_adaptive'] 64 65# DRAMCtrl is a single-channel single-ported DRAM controller model 66# that aims to model the most important system-level performance 67# effects of a DRAM without getting into too much detail of the DRAM 68# itself. 69class DRAMCtrl(AbstractMemory): 70 type = 'DRAMCtrl' 71 cxx_header = "mem/dram_ctrl.hh" 72 73 # single-ported on the system interface side, instantiate with a 74 # bus in front of the controller for multiple ports 75 port = SlavePort("Slave port") 76 77 # the basic configuration of the controller architecture, note 78 # that each entry corresponds to a burst for the specific DRAM 79 # configuration (e.g. x32 with burst length 8 is 32 bytes) and not 80 # the cacheline size or request/packet size 81 write_buffer_size = Param.Unsigned(64, "Number of write queue entries") 82 read_buffer_size = Param.Unsigned(32, "Number of read queue entries") 83 84 # threshold in percent for when to forcefully trigger writes and 85 # start emptying the write buffer 86 write_high_thresh_perc = Param.Percent(85, "Threshold to force writes") 87 88 # threshold in percentage for when to start writes if the read 89 # queue is empty 90 write_low_thresh_perc = Param.Percent(50, "Threshold to start writes") 91 92 # minimum write bursts to schedule before switching back to reads 93 min_writes_per_switch = Param.Unsigned(16, "Minimum write bursts before " 94 "switching to reads") 95 96 # scheduler, address map and page policy 97 mem_sched_policy = Param.MemSched('frfcfs', "Memory scheduling policy") 98 addr_mapping = Param.AddrMap('RoRaBaCoCh', "Address mapping policy") 99 page_policy = Param.PageManage('open_adaptive', "Page management policy") 100 101 # enforce a limit on the number of accesses per row 102 max_accesses_per_row = Param.Unsigned(16, "Max accesses per row before " 103 "closing"); 104 105 # size of DRAM Chip in Bytes 106 device_size = Param.MemorySize("Size of DRAM chip") 107 108 # pipeline latency of the controller and PHY, split into a 109 # frontend part and a backend part, with reads and writes serviced 110 # by the queues only seeing the frontend contribution, and reads 111 # serviced by the memory seeing the sum of the two 112 static_frontend_latency = Param.Latency("10ns", "Static frontend latency") 113 static_backend_latency = Param.Latency("10ns", "Static backend latency") 114 115 # the physical organisation of the DRAM 116 device_bus_width = Param.Unsigned("data bus width in bits for each DRAM "\ 117 "device/chip") 118 burst_length = Param.Unsigned("Burst lenght (BL) in beats") 119 device_rowbuffer_size = Param.MemorySize("Page (row buffer) size per "\ 120 "device/chip") 121 devices_per_rank = Param.Unsigned("Number of devices/chips per rank") 122 ranks_per_channel = Param.Unsigned("Number of ranks per channel") 123 124 # default to 0 bank groups per rank, indicating bank group architecture 125 # is not used 126 # update per memory class when bank group architecture is supported 127 bank_groups_per_rank = Param.Unsigned(0, "Number of bank groups per rank") 128 banks_per_rank = Param.Unsigned("Number of banks per rank") 129 # only used for the address mapping as the controller by 130 # construction is a single channel and multiple controllers have 131 # to be instantiated for a multi-channel configuration 132 channels = Param.Unsigned(1, "Number of channels") 133 134 # For power modelling we need to know if the DRAM has a DLL or not 135 dll = Param.Bool(True, "DRAM has DLL or not") 136 137 # DRAMPower provides in addition to the core power, the possibility to 138 # include RD/WR termination and IO power. This calculation assumes some 139 # default values. The integration of DRAMPower with gem5 does not include 140 # IO and RD/WR termination power by default. This might be added as an 141 # additional feature in the future. 142 143 # timing behaviour and constraints - all in nanoseconds 144 145 # the base clock period of the DRAM 146 tCK = Param.Latency("Clock period") 147 148 # the amount of time in nanoseconds from issuing an activate command 149 # to the data being available in the row buffer for a read/write 150 tRCD = Param.Latency("RAS to CAS delay") 151 152 # the time from issuing a read/write command to seeing the actual data 153 tCL = Param.Latency("CAS latency") 154 155 # minimum time between a precharge and subsequent activate 156 tRP = Param.Latency("Row precharge time") 157 158 # minimum time between an activate and a precharge to the same row 159 tRAS = Param.Latency("ACT to PRE delay") 160 161 # minimum time between a write data transfer and a precharge 162 tWR = Param.Latency("Write recovery time") 163 164 # minimum time between a read and precharge command 165 tRTP = Param.Latency("Read to precharge") 166 167 # time to complete a burst transfer, typically the burst length 168 # divided by two due to the DDR bus, but by making it a parameter 169 # it is easier to also evaluate SDR memories like WideIO. 170 # This parameter has to account for burst length. 171 # Read/Write requests with data size larger than one full burst are broken 172 # down into multiple requests in the controller 173 # tBURST is equivalent to the CAS-to-CAS delay (tCCD) 174 # With bank group architectures, tBURST represents the CAS-to-CAS 175 # delay for bursts to different bank groups (tCCD_S) 176 tBURST = Param.Latency("Burst duration (for DDR burst length / 2 cycles)") 177 178 # CAS-to-CAS delay for bursts to the same bank group 179 # only utilized with bank group architectures; set to 0 for default case 180 # tBURST is equivalent to tCCD_S; no explicit parameter required 181 # for CAS-to-CAS delay for bursts to different bank groups 182 tCCD_L = Param.Latency("0ns", "Same bank group CAS to CAS delay") 183 184 # time taken to complete one refresh cycle (N rows in all banks) 185 tRFC = Param.Latency("Refresh cycle time") 186 187 # refresh command interval, how often a "ref" command needs 188 # to be sent. It is 7.8 us for a 64ms refresh requirement 189 tREFI = Param.Latency("Refresh command interval") 190 191 # write-to-read, same rank turnaround penalty 192 tWTR = Param.Latency("Write to read, same rank switching time") 193 194 # read-to-write, same rank turnaround penalty 195 tRTW = Param.Latency("Read to write, same rank switching time") 196 197 # rank-to-rank bus delay penalty 198 # this does not correlate to a memory timing parameter and encompasses: 199 # 1) RD-to-RD, 2) WR-to-WR, 3) RD-to-WR, and 4) WR-to-RD 200 # different rank bus delay 201 tCS = Param.Latency("Rank to rank switching time") 202 203 # minimum row activate to row activate delay time 204 tRRD = Param.Latency("ACT to ACT delay") 205 206 # only utilized with bank group architectures; set to 0 for default case 207 tRRD_L = Param.Latency("0ns", "Same bank group ACT to ACT delay") 208 209 # time window in which a maximum number of activates are allowed 210 # to take place, set to 0 to disable 211 tXAW = Param.Latency("X activation window") 212 activation_limit = Param.Unsigned("Max number of activates in window") 213 214 # time to exit power-down mode 215 # Exit power-down to next valid command delay 216 tXP = Param.Latency("0ns", "Power-up Delay") 217 218 # Exit Powerdown to commands requiring a locked DLL 219 tXPDLL = Param.Latency("0ns", "Power-up Delay with locked DLL") 220 221 # time to exit self-refresh mode 222 tXS = Param.Latency("0ns", "Self-refresh exit latency") 223 224 # time to exit self-refresh mode with locked DLL 225 tXSDLL = Param.Latency("0ns", "Self-refresh exit latency DLL") 226 227 # Currently rolled into other params 228 ###################################################################### 229 230 # tRC - assumed to be tRAS + tRP 231 232 # Power Behaviour and Constraints 233 # DRAMs like LPDDR and WideIO have 2 external voltage domains. These are 234 # defined as VDD and VDD2. Each current is defined for each voltage domain 235 # separately. For example, current IDD0 is active-precharge current for 236 # voltage domain VDD and current IDD02 is active-precharge current for 237 # voltage domain VDD2. 238 # By default all currents are set to 0mA. Users who are only interested in 239 # the performance of DRAMs can leave them at 0. 240 241 # Operating 1 Bank Active-Precharge current 242 IDD0 = Param.Current("0mA", "Active precharge current") 243 244 # Operating 1 Bank Active-Precharge current multiple voltage Range 245 IDD02 = Param.Current("0mA", "Active precharge current VDD2") 246 247 # Precharge Power-down Current: Slow exit 248 IDD2P0 = Param.Current("0mA", "Precharge Powerdown slow") 249 250 # Precharge Power-down Current: Slow exit multiple voltage Range 251 IDD2P02 = Param.Current("0mA", "Precharge Powerdown slow VDD2") 252 253 # Precharge Power-down Current: Fast exit 254 IDD2P1 = Param.Current("0mA", "Precharge Powerdown fast") 255 256 # Precharge Power-down Current: Fast exit multiple voltage Range 257 IDD2P12 = Param.Current("0mA", "Precharge Powerdown fast VDD2") 258 259 # Precharge Standby current 260 IDD2N = Param.Current("0mA", "Precharge Standby current") 261 262 # Precharge Standby current multiple voltage range 263 IDD2N2 = Param.Current("0mA", "Precharge Standby current VDD2") 264 265 # Active Power-down current: slow exit 266 IDD3P0 = Param.Current("0mA", "Active Powerdown slow") 267 268 # Active Power-down current: slow exit multiple voltage range 269 IDD3P02 = Param.Current("0mA", "Active Powerdown slow VDD2") 270 271 # Active Power-down current : fast exit 272 IDD3P1 = Param.Current("0mA", "Active Powerdown fast") 273 274 # Active Power-down current : fast exit multiple voltage range 275 IDD3P12 = Param.Current("0mA", "Active Powerdown fast VDD2") 276 277 # Active Standby current 278 IDD3N = Param.Current("0mA", "Active Standby current") 279 280 # Active Standby current multiple voltage range 281 IDD3N2 = Param.Current("0mA", "Active Standby current VDD2") 282 283 # Burst Read Operating Current 284 IDD4R = Param.Current("0mA", "READ current") 285 286 # Burst Read Operating Current multiple voltage range 287 IDD4R2 = Param.Current("0mA", "READ current VDD2") 288 289 # Burst Write Operating Current 290 IDD4W = Param.Current("0mA", "WRITE current") 291 292 # Burst Write Operating Current multiple voltage range 293 IDD4W2 = Param.Current("0mA", "WRITE current VDD2") 294 295 # Refresh Current 296 IDD5 = Param.Current("0mA", "Refresh current") 297 298 # Refresh Current multiple voltage range 299 IDD52 = Param.Current("0mA", "Refresh current VDD2") 300 301 # Self-Refresh Current 302 IDD6 = Param.Current("0mA", "Self-refresh Current") 303 304 # Self-Refresh Current multiple voltage range 305 IDD62 = Param.Current("0mA", "Self-refresh Current VDD2") 306 307 # Main voltage range of the DRAM 308 VDD = Param.Voltage("0V", "Main Voltage Range") 309 310 # Second voltage range defined by some DRAMs 311 VDD2 = Param.Voltage("0V", "2nd Voltage Range") 312 313# A single DDR3-1600 x64 channel (one command and address bus), with 314# timings based on a DDR3-1600 4 Gbit datasheet (Micron MT41J512M8) in 315# an 8x8 configuration. 316class DDR3_1600_x64(DRAMCtrl): 317 # size of device in bytes 318 device_size = '512MB' 319 320 # 8x8 configuration, 8 devices each with an 8-bit interface 321 device_bus_width = 8 322 323 # DDR3 is a BL8 device 324 burst_length = 8 325 326 # Each device has a page (row buffer) size of 1 Kbyte (1K columns x8) 327 device_rowbuffer_size = '1kB' 328 329 # 8x8 configuration, so 8 devices 330 devices_per_rank = 8 331 332 # Use two ranks 333 ranks_per_channel = 2 334 335 # DDR3 has 8 banks in all configurations 336 banks_per_rank = 8 337 338 # 800 MHz 339 tCK = '1.25ns' 340 341 # 8 beats across an x64 interface translates to 4 clocks @ 800 MHz 342 tBURST = '5ns' 343 344 # DDR3-1600 11-11-11 345 tRCD = '13.75ns' 346 tCL = '13.75ns' 347 tRP = '13.75ns' 348 tRAS = '35ns' 349 tRRD = '6ns' 350 tXAW = '30ns' 351 activation_limit = 4 352 tRFC = '260ns' 353 354 tWR = '15ns' 355 356 # Greater of 4 CK or 7.5 ns 357 tWTR = '7.5ns' 358 359 # Greater of 4 CK or 7.5 ns 360 tRTP = '7.5ns' 361 362 # Default same rank rd-to-wr bus turnaround to 2 CK, @800 MHz = 2.5 ns 363 tRTW = '2.5ns' 364 365 # Default different rank bus delay to 2 CK, @800 MHz = 2.5 ns 366 tCS = '2.5ns' 367 368 # <=85C, half for >85C 369 tREFI = '7.8us' 370 371 # Current values from datasheet 372 IDD0 = '75mA' 373 IDD2N = '50mA' 374 IDD3N = '57mA' 375 IDD4W = '165mA' 376 IDD4R = '187mA' 377 IDD5 = '220mA' 378 VDD = '1.5V' 379 380# A single HMC-2500 x32 model based on: 381# [1] DRAMSpec: a high-level DRAM bank modelling tool 382# developed at the University of Kaiserslautern. This high level tool 383# uses RC (resistance-capacitance) and CV (capacitance-voltage) models to 384# estimate the DRAM bank latency and power numbers. 385# [2] A Logic-base Interconnect for Supporting Near Memory Computation in the 386# Hybrid Memory Cube (E. Azarkhish et. al) 387# Assumed for the HMC model is a 30 nm technology node. 388# The modelled HMC consists of 4 Gbit layers which sum up to 2GB of memory (4 389# layers). 390# Each layer has 16 vaults and each vault consists of 2 banks per layer. 391# In order to be able to use the same controller used for 2D DRAM generations 392# for HMC, the following analogy is done: 393# Channel (DDR) => Vault (HMC) 394# device_size (DDR) => size of a single layer in a vault 395# ranks per channel (DDR) => number of layers 396# banks per rank (DDR) => banks per layer 397# devices per rank (DDR) => devices per layer ( 1 for HMC). 398# The parameters for which no input is available are inherited from the DDR3 399# configuration. 400# This configuration includes the latencies from the DRAM to the logic layer of 401# the HMC 402class HMC_2500_x32(DDR3_1600_x64): 403 # size of device 404 # two banks per device with each bank 4MB [2] 405 device_size = '8MB' 406 407 # 1x32 configuration, 1 device with 32 TSVs [2] 408 device_bus_width = 32 409 410 # HMC is a BL8 device [2] 411 burst_length = 8 412 413 # Each device has a page (row buffer) size of 256 bytes [2] 414 device_rowbuffer_size = '256B' 415 416 # 1x32 configuration, so 1 device [2] 417 devices_per_rank = 1 418 419 # 4 layers so 4 ranks [2] 420 ranks_per_channel = 4 421 422 # HMC has 2 banks per layer [2] 423 # Each layer represents a rank. With 4 layers and 8 banks in total, each 424 # layer has 2 banks; thus 2 banks per rank. 425 banks_per_rank = 2 426 427 # 1250 MHz [2] 428 tCK = '0.8ns' 429 430 # 8 beats across an x32 interface translates to 4 clocks @ 1250 MHz 431 tBURST = '3.2ns' 432 433 # Values using DRAMSpec HMC model [1] 434 tRCD = '10.2ns' 435 tCL = '9.9ns' 436 tRP = '7.7ns' 437 tRAS = '21.6ns' 438 439 # tRRD depends on the power supply network for each vendor. 440 # We assume a tRRD of a double bank approach to be equal to 4 clock 441 # cycles (Assumption) 442 tRRD = '3.2ns' 443 444 # activation limit is set to 0 since there are only 2 banks per vault layer. 445 activation_limit = 0 446 447 # Values using DRAMSpec HMC model [1] 448 tRFC = '59ns' 449 tWR = '8ns' 450 tRTP = '4.9ns' 451 452 # Default different rank bus delay assumed to 1 CK for TSVs, @1250 MHz = 0.8 453 # ns (Assumption) 454 tCS = '0.8ns' 455 456 # Value using DRAMSpec HMC model [1] 457 tREFI = '3.9us' 458 459 # Set default controller parameters 460 page_policy = 'close' 461 write_buffer_size = 8 462 read_buffer_size = 8 463 addr_mapping = 'RoCoRaBaCh' 464 min_writes_per_switch = 8 465 466# A single DDR3-2133 x64 channel refining a selected subset of the 467# options for the DDR-1600 configuration, based on the same DDR3-1600 468# 4 Gbit datasheet (Micron MT41J512M8). Most parameters are kept 469# consistent across the two configurations. 470class DDR3_2133_x64(DDR3_1600_x64): 471 # 1066 MHz 472 tCK = '0.938ns' 473 474 # 8 beats across an x64 interface translates to 4 clocks @ 1066 MHz 475 tBURST = '3.752ns' 476 477 # DDR3-2133 14-14-14 478 tRCD = '13.09ns' 479 tCL = '13.09ns' 480 tRP = '13.09ns' 481 tRAS = '33ns' 482 tRRD = '5ns' 483 tXAW = '25ns' 484 485 # Current values from datasheet 486 IDD0 = '70mA' 487 IDD2N = '37mA' 488 IDD3N = '44mA' 489 IDD4W = '157mA' 490 IDD4R = '191mA' 491 IDD5 = '250mA' 492 VDD = '1.5V' 493 494# A single DDR4-2400 x64 channel (one command and address bus), with 495# timings based on a DDR4-2400 4 Gbit datasheet (Micron MT40A512M8) 496# in an 8x8 configuration. 497class DDR4_2400_x64(DRAMCtrl): 498 # size of device 499 device_size = '512MB' 500 501 # 8x8 configuration, 8 devices each with an 8-bit interface 502 device_bus_width = 8 503 504 # DDR4 is a BL8 device 505 burst_length = 8 506 507 # Each device has a page (row buffer) size of 1 Kbyte (1K columns x8) 508 device_rowbuffer_size = '1kB' 509 510 # 8x8 configuration, so 8 devices 511 devices_per_rank = 8 512 513 # Match our DDR3 configurations which is dual rank 514 ranks_per_channel = 2 515 516 # DDR4 has 2 (x16) or 4 (x4 and x8) bank groups 517 # Set to 4 for x4, x8 case 518 bank_groups_per_rank = 4 519 520 # DDR4 has 16 banks (4 bank groups) in all 521 # configurations. Currently we do not capture the additional 522 # constraints incurred by the bank groups 523 banks_per_rank = 16 524 525 # override the default buffer sizes and go for something larger to 526 # accommodate the larger bank count 527 write_buffer_size = 128 528 read_buffer_size = 64 529 530 # 1200 MHz 531 tCK = '0.833ns' 532 533 # 8 beats across an x64 interface translates to 4 clocks @ 1200 MHz 534 # tBURST is equivalent to the CAS-to-CAS delay (tCCD) 535 # With bank group architectures, tBURST represents the CAS-to-CAS 536 # delay for bursts to different bank groups (tCCD_S) 537 tBURST = '3.333ns' 538 539 # @2400 data rate, tCCD_L is 6 CK 540 # CAS-to-CAS delay for bursts to the same bank group 541 # tBURST is equivalent to tCCD_S; no explicit parameter required 542 # for CAS-to-CAS delay for bursts to different bank groups 543 tCCD_L = '5ns'; 544 545 # DDR4-2400 17-17-17 546 tRCD = '14.16ns' 547 tCL = '14.16ns' 548 tRP = '14.16ns' 549 tRAS = '32ns' 550 551 # RRD_S (different bank group) for 1K page is MAX(4 CK, 3.3ns) 552 tRRD = '3.3ns' 553 554 # RRD_L (same bank group) for 1K page is MAX(4 CK, 4.9ns) 555 tRRD_L = '4.9ns'; 556 557 tXAW = '21ns' 558 activation_limit = 4 559 tRFC = '350ns' 560 561 tWR = '15ns' 562 563 # Here using the average of WTR_S and WTR_L 564 tWTR = '5ns' 565 566 # Greater of 4 CK or 7.5 ns 567 tRTP = '7.5ns' 568 569 # Default same rank rd-to-wr bus turnaround to 2 CK, @1200 MHz = 1.666 ns 570 tRTW = '1.666ns' 571 572 # Default different rank bus delay to 2 CK, @1200 MHz = 1.666 ns 573 tCS = '1.666ns' 574 575 # <=85C, half for >85C 576 tREFI = '7.8us' 577 578 # Current values from datasheet 579 IDD0 = '64mA' 580 IDD02 = '4mA' 581 IDD2N = '50mA' 582 IDD3N = '67mA' 583 IDD3N2 = '3mA' 584 IDD4W = '180mA' 585 IDD4R = '160mA' 586 IDD5 = '192mA' 587 VDD = '1.2V' 588 VDD2 = '2.5V' 589 590# A single LPDDR2-S4 x32 interface (one command/address bus), with 591# default timings based on a LPDDR2-1066 4 Gbit part (Micron MT42L128M32D1) 592# in a 1x32 configuration. 593class LPDDR2_S4_1066_x32(DRAMCtrl): 594 # No DLL in LPDDR2 595 dll = False 596 597 # size of device 598 device_size = '512MB' 599 600 # 1x32 configuration, 1 device with a 32-bit interface 601 device_bus_width = 32 602 603 # LPDDR2_S4 is a BL4 and BL8 device 604 burst_length = 8 605 606 # Each device has a page (row buffer) size of 1KB 607 # (this depends on the memory density) 608 device_rowbuffer_size = '1kB' 609 610 # 1x32 configuration, so 1 device 611 devices_per_rank = 1 612 613 # Use a single rank 614 ranks_per_channel = 1 615 616 # LPDDR2-S4 has 8 banks in all configurations 617 banks_per_rank = 8 618 619 # 533 MHz 620 tCK = '1.876ns' 621 622 # Fixed at 15 ns 623 tRCD = '15ns' 624 625 # 8 CK read latency, 4 CK write latency @ 533 MHz, 1.876 ns cycle time 626 tCL = '15ns' 627 628 # Pre-charge one bank 15 ns (all banks 18 ns) 629 tRP = '15ns' 630 631 tRAS = '42ns' 632 tWR = '15ns' 633 634 tRTP = '7.5ns' 635 636 # 8 beats across an x32 DDR interface translates to 4 clocks @ 533 MHz. 637 # Note this is a BL8 DDR device. 638 # Requests larger than 32 bytes are broken down into multiple requests 639 # in the controller 640 tBURST = '7.5ns' 641 642 # LPDDR2-S4, 4 Gbit 643 tRFC = '130ns' 644 tREFI = '3.9us' 645 646 # Irrespective of speed grade, tWTR is 7.5 ns 647 tWTR = '7.5ns' 648 649 # Default same rank rd-to-wr bus turnaround to 2 CK, @533 MHz = 3.75 ns 650 tRTW = '3.75ns' 651 652 # Default different rank bus delay to 2 CK, @533 MHz = 3.75 ns 653 tCS = '3.75ns' 654 655 # Activate to activate irrespective of density and speed grade 656 tRRD = '10.0ns' 657 658 # Irrespective of density, tFAW is 50 ns 659 tXAW = '50ns' 660 activation_limit = 4 661 662 # Current values from datasheet 663 IDD0 = '15mA' 664 IDD02 = '70mA' 665 IDD2N = '2mA' 666 IDD2N2 = '30mA' 667 IDD3N = '2.5mA' 668 IDD3N2 = '30mA' 669 IDD4W = '10mA' 670 IDD4W2 = '190mA' 671 IDD4R = '3mA' 672 IDD4R2 = '220mA' 673 IDD5 = '40mA' 674 IDD52 = '150mA' 675 VDD = '1.8V' 676 VDD2 = '1.2V' 677 678# A single WideIO x128 interface (one command and address bus), with 679# default timings based on an estimated WIO-200 8 Gbit part. 680class WideIO_200_x128(DRAMCtrl): 681 # No DLL for WideIO 682 dll = False 683 684 # size of device 685 device_size = '1024MB' 686 687 # 1x128 configuration, 1 device with a 128-bit interface 688 device_bus_width = 128 689 690 # This is a BL4 device 691 burst_length = 4 692 693 # Each device has a page (row buffer) size of 4KB 694 # (this depends on the memory density) 695 device_rowbuffer_size = '4kB' 696 697 # 1x128 configuration, so 1 device 698 devices_per_rank = 1 699 700 # Use one rank for a one-high die stack 701 ranks_per_channel = 1 702 703 # WideIO has 4 banks in all configurations 704 banks_per_rank = 4 705 706 # 200 MHz 707 tCK = '5ns' 708 709 # WIO-200 710 tRCD = '18ns' 711 tCL = '18ns' 712 tRP = '18ns' 713 tRAS = '42ns' 714 tWR = '15ns' 715 # Read to precharge is same as the burst 716 tRTP = '20ns' 717 718 # 4 beats across an x128 SDR interface translates to 4 clocks @ 200 MHz. 719 # Note this is a BL4 SDR device. 720 tBURST = '20ns' 721 722 # WIO 8 Gb 723 tRFC = '210ns' 724 725 # WIO 8 Gb, <=85C, half for >85C 726 tREFI = '3.9us' 727 728 # Greater of 2 CK or 15 ns, 2 CK @ 200 MHz = 10 ns 729 tWTR = '15ns' 730 731 # Default same rank rd-to-wr bus turnaround to 2 CK, @200 MHz = 10 ns 732 tRTW = '10ns' 733 734 # Default different rank bus delay to 2 CK, @200 MHz = 10 ns 735 tCS = '10ns' 736 737 # Activate to activate irrespective of density and speed grade 738 tRRD = '10.0ns' 739 740 # Two instead of four activation window 741 tXAW = '50ns' 742 activation_limit = 2 743 744 # The WideIO specification does not provide current information 745 746# A single LPDDR3 x32 interface (one command/address bus), with 747# default timings based on a LPDDR3-1600 4 Gbit part (Micron 748# EDF8132A1MC) in a 1x32 configuration. 749class LPDDR3_1600_x32(DRAMCtrl): 750 # No DLL for LPDDR3 751 dll = False 752 753 # size of device 754 device_size = '512MB' 755 756 # 1x32 configuration, 1 device with a 32-bit interface 757 device_bus_width = 32 758 759 # LPDDR3 is a BL8 device 760 burst_length = 8 761 762 # Each device has a page (row buffer) size of 4KB 763 device_rowbuffer_size = '4kB' 764 765 # 1x32 configuration, so 1 device 766 devices_per_rank = 1 767 768 # Technically the datasheet is a dual-rank package, but for 769 # comparison with the LPDDR2 config we stick to a single rank 770 ranks_per_channel = 1 771 772 # LPDDR3 has 8 banks in all configurations 773 banks_per_rank = 8 774 775 # 800 MHz 776 tCK = '1.25ns' 777 778 tRCD = '18ns' 779 780 # 12 CK read latency, 6 CK write latency @ 800 MHz, 1.25 ns cycle time 781 tCL = '15ns' 782 783 tRAS = '42ns' 784 tWR = '15ns' 785 786 # Greater of 4 CK or 7.5 ns, 4 CK @ 800 MHz = 5 ns 787 tRTP = '7.5ns' 788 789 # Pre-charge one bank 18 ns (all banks 21 ns) 790 tRP = '18ns' 791 792 # 8 beats across a x32 DDR interface translates to 4 clocks @ 800 MHz. 793 # Note this is a BL8 DDR device. 794 # Requests larger than 32 bytes are broken down into multiple requests 795 # in the controller 796 tBURST = '5ns' 797 798 # LPDDR3, 4 Gb 799 tRFC = '130ns' 800 tREFI = '3.9us' 801 802 # Irrespective of speed grade, tWTR is 7.5 ns 803 tWTR = '7.5ns' 804 805 # Default same rank rd-to-wr bus turnaround to 2 CK, @800 MHz = 2.5 ns 806 tRTW = '2.5ns' 807 808 # Default different rank bus delay to 2 CK, @800 MHz = 2.5 ns 809 tCS = '2.5ns' 810 811 # Activate to activate irrespective of density and speed grade 812 tRRD = '10.0ns' 813 814 # Irrespective of size, tFAW is 50 ns 815 tXAW = '50ns' 816 activation_limit = 4 817 818 # Current values from datasheet 819 IDD0 = '8mA' 820 IDD02 = '60mA' 821 IDD2N = '0.8mA' 822 IDD2N2 = '26mA' 823 IDD3N = '2mA' 824 IDD3N2 = '34mA' 825 IDD4W = '2mA' 826 IDD4W2 = '190mA' 827 IDD4R = '2mA' 828 IDD4R2 = '230mA' 829 IDD5 = '28mA' 830 IDD52 = '150mA' 831 VDD = '1.8V' 832 VDD2 = '1.2V' 833 834# A single GDDR5 x64 interface, with 835# default timings based on a GDDR5-4000 1 Gbit part (SK Hynix 836# H5GQ1H24AFR) in a 2x32 configuration. 837class GDDR5_4000_x64(DRAMCtrl): 838 # size of device 839 device_size = '128MB' 840 841 # 2x32 configuration, 1 device with a 32-bit interface 842 device_bus_width = 32 843 844 # GDDR5 is a BL8 device 845 burst_length = 8 846 847 # Each device has a page (row buffer) size of 2Kbits (256Bytes) 848 device_rowbuffer_size = '256B' 849 850 # 2x32 configuration, so 2 devices 851 devices_per_rank = 2 852 853 # assume single rank 854 ranks_per_channel = 1 855 856 # GDDR5 has 4 bank groups 857 bank_groups_per_rank = 4 858 859 # GDDR5 has 16 banks with 4 bank groups 860 banks_per_rank = 16 861 862 # 1000 MHz 863 tCK = '1ns' 864 865 # 8 beats across an x64 interface translates to 2 clocks @ 1000 MHz 866 # Data bus runs @2000 Mhz => DDR ( data runs at 4000 MHz ) 867 # 8 beats at 4000 MHz = 2 beats at 1000 MHz 868 # tBURST is equivalent to the CAS-to-CAS delay (tCCD) 869 # With bank group architectures, tBURST represents the CAS-to-CAS 870 # delay for bursts to different bank groups (tCCD_S) 871 tBURST = '2ns' 872 873 # @1000MHz data rate, tCCD_L is 3 CK 874 # CAS-to-CAS delay for bursts to the same bank group 875 # tBURST is equivalent to tCCD_S; no explicit parameter required 876 # for CAS-to-CAS delay for bursts to different bank groups 877 tCCD_L = '3ns'; 878 879 tRCD = '12ns' 880 881 # tCL is not directly found in datasheet and assumed equal tRCD 882 tCL = '12ns' 883 884 tRP = '12ns' 885 tRAS = '28ns' 886 887 # RRD_S (different bank group) 888 # RRD_S is 5.5 ns in datasheet. 889 # rounded to the next multiple of tCK 890 tRRD = '6ns' 891 892 # RRD_L (same bank group) 893 # RRD_L is 5.5 ns in datasheet. 894 # rounded to the next multiple of tCK 895 tRRD_L = '6ns' 896 897 tXAW = '23ns' 898 899 # tXAW < 4 x tRRD. 900 # Therefore, activation limit is set to 0 901 activation_limit = 0 902 903 tRFC = '65ns' 904 tWR = '12ns' 905 906 # Here using the average of WTR_S and WTR_L 907 tWTR = '5ns' 908 909 # Read-to-Precharge 2 CK 910 tRTP = '2ns' 911 912 # Assume 2 cycles 913 tRTW = '2ns' 914 915# A single HBM x128 interface (one command and address bus), with 916# default timings based on data publically released 917# ("HBM: Memory Solution for High Performance Processors", MemCon, 2014), 918# IDD measurement values, and by extrapolating data from other classes. 919# Architecture values based on published HBM spec 920# A 4H stack is defined, 2Gb per die for a total of 1GB of memory. 921class HBM_1000_4H_x128(DRAMCtrl): 922 # HBM gen1 supports up to 8 128-bit physical channels 923 # Configuration defines a single channel, with the capacity 924 # set to (full_ stack_capacity / 8) based on 2Gb dies 925 # To use all 8 channels, set 'channels' parameter to 8 in 926 # system configuration 927 928 # 128-bit interface legacy mode 929 device_bus_width = 128 930 931 # HBM supports BL4 and BL2 (legacy mode only) 932 burst_length = 4 933 934 # size of channel in bytes, 4H stack of 2Gb dies is 1GB per stack; 935 # with 8 channels, 128MB per channel 936 device_size = '128MB' 937 938 device_rowbuffer_size = '2kB' 939 940 # 1x128 configuration 941 devices_per_rank = 1 942 943 # HBM does not have a CS pin; set rank to 1 944 ranks_per_channel = 1 945 946 # HBM has 8 or 16 banks depending on capacity 947 # 2Gb dies have 8 banks 948 banks_per_rank = 8 949 950 # depending on frequency, bank groups may be required 951 # will always have 4 bank groups when enabled 952 # current specifications do not define the minimum frequency for 953 # bank group architecture 954 # setting bank_groups_per_rank to 0 to disable until range is defined 955 bank_groups_per_rank = 0 956 957 # 500 MHz for 1Gbps DDR data rate 958 tCK = '2ns' 959 960 # use values from IDD measurement in JEDEC spec 961 # use tRP value for tRCD and tCL similar to other classes 962 tRP = '15ns' 963 tRCD = '15ns' 964 tCL = '15ns' 965 tRAS = '33ns' 966 967 # BL2 and BL4 supported, default to BL4 968 # DDR @ 500 MHz means 4 * 2ns / 2 = 4ns 969 tBURST = '4ns' 970 971 # value for 2Gb device from JEDEC spec 972 tRFC = '160ns' 973 974 # value for 2Gb device from JEDEC spec 975 tREFI = '3.9us' 976 977 # extrapolate the following from LPDDR configs, using ns values 978 # to minimize burst length, prefetch differences 979 tWR = '18ns' 980 tRTP = '7.5ns' 981 tWTR = '10ns' 982 983 # start with 2 cycles turnaround, similar to other memory classes 984 # could be more with variations across the stack 985 tRTW = '4ns' 986 987 # single rank device, set to 0 988 tCS = '0ns' 989 990 # from MemCon example, tRRD is 4ns with 2ns tCK 991 tRRD = '4ns' 992 993 # from MemCon example, tFAW is 30ns with 2ns tCK 994 tXAW = '30ns' 995 activation_limit = 4 996 997 # 4tCK 998 tXP = '8ns' 999 1000 # start with tRFC + tXP -> 160ns + 8ns = 168ns 1001 tXS = '168ns' 1002 1003# A single HBM x64 interface (one command and address bus), with 1004# default timings based on HBM gen1 and data publically released 1005# A 4H stack is defined, 8Gb per die for a total of 4GB of memory. 1006# Note: This defines a pseudo-channel with a unique controller 1007# instantiated per pseudo-channel 1008# Stay at same IO rate (1Gbps) to maintain timing relationship with 1009# HBM gen1 class (HBM_1000_4H_x128) where possible 1010class HBM_1000_4H_x64(HBM_1000_4H_x128): 1011 # For HBM gen2 with pseudo-channel mode, configure 2X channels. 1012 # Configuration defines a single pseudo channel, with the capacity 1013 # set to (full_ stack_capacity / 16) based on 8Gb dies 1014 # To use all 16 pseudo channels, set 'channels' parameter to 16 in 1015 # system configuration 1016 1017 # 64-bit pseudo-channle interface 1018 device_bus_width = 64 1019 1020 # HBM pseudo-channel only supports BL4 1021 burst_length = 4 1022 1023 # size of channel in bytes, 4H stack of 8Gb dies is 4GB per stack; 1024 # with 16 channels, 256MB per channel 1025 device_size = '256MB' 1026 1027 # page size is halved with pseudo-channel; maintaining the same same number 1028 # of rows per pseudo-channel with 2X banks across 2 channels 1029 device_rowbuffer_size = '1kB' 1030 1031 # HBM has 8 or 16 banks depending on capacity 1032 # Starting with 4Gb dies, 16 banks are defined 1033 banks_per_rank = 16 1034 1035 # reset tRFC for larger, 8Gb device 1036 # use HBM1 4Gb value as a starting point 1037 tRFC = '260ns' 1038 1039 # start with tRFC + tXP -> 160ns + 8ns = 168ns 1040 tXS = '268ns' 1041 # Default different rank bus delay to 2 CK, @1000 MHz = 2 ns 1042 tCS = '2ns' 1043 tREFI = '3.9us' 1044