DRAMCtrl.py revision 11120:eef83ecab5bf
1# Copyright (c) 2012-2014 ARM Limited
2# All rights reserved.
3#
4# The license below extends only to copyright in the software and shall
5# not be construed as granting a license to any other intellectual
6# property including but not limited to intellectual property relating
7# to a hardware implementation of the functionality of the software
8# licensed hereunder.  You may use the software subject to the license
9# terms below provided that you ensure that this notice is replicated
10# unmodified and in its entirety in all distributions of the software,
11# modified or unmodified, in source code or in binary form.
12#
13# Copyright (c) 2013 Amin Farmahini-Farahani
14# Copyright (c) 2015 University of Kaiserslautern
15# All rights reserved.
16#
17# Redistribution and use in source and binary forms, with or without
18# modification, are permitted provided that the following conditions are
19# met: redistributions of source code must retain the above copyright
20# notice, this list of conditions and the following disclaimer;
21# redistributions in binary form must reproduce the above copyright
22# notice, this list of conditions and the following disclaimer in the
23# documentation and/or other materials provided with the distribution;
24# neither the name of the copyright holders nor the names of its
25# contributors may be used to endorse or promote products derived from
26# this software without specific prior written permission.
27#
28# THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT HOLDERS AND CONTRIBUTORS
29# "AS IS" AND ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT
30# LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR
31# A PARTICULAR PURPOSE ARE DISCLAIMED. IN NO EVENT SHALL THE COPYRIGHT
32# OWNER OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL,
33# SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT
34# LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE,
35# DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY
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38# OF THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
39#
40# Authors: Andreas Hansson
41#          Ani Udipi
42#          Omar Naji
43#          Matthias Jung
44
45from m5.params import *
46from AbstractMemory import *
47
48# Enum for memory scheduling algorithms, currently First-Come
49# First-Served and a First-Row Hit then First-Come First-Served
50class MemSched(Enum): vals = ['fcfs', 'frfcfs']
51
52# Enum for the address mapping. With Ch, Ra, Ba, Ro and Co denoting
53# channel, rank, bank, row and column, respectively, and going from
54# MSB to LSB.  Available are RoRaBaChCo and RoRaBaCoCh, that are
55# suitable for an open-page policy, optimising for sequential accesses
56# hitting in the open row. For a closed-page policy, RoCoRaBaCh
57# maximises parallelism.
58class AddrMap(Enum): vals = ['RoRaBaChCo', 'RoRaBaCoCh', 'RoCoRaBaCh']
59
60# Enum for the page policy, either open, open_adaptive, close, or
61# close_adaptive.
62class PageManage(Enum): vals = ['open', 'open_adaptive', 'close',
63                                'close_adaptive']
64
65# DRAMCtrl is a single-channel single-ported DRAM controller model
66# that aims to model the most important system-level performance
67# effects of a DRAM without getting into too much detail of the DRAM
68# itself.
69class DRAMCtrl(AbstractMemory):
70    type = 'DRAMCtrl'
71    cxx_header = "mem/dram_ctrl.hh"
72
73    # single-ported on the system interface side, instantiate with a
74    # bus in front of the controller for multiple ports
75    port = SlavePort("Slave port")
76
77    # the basic configuration of the controller architecture, note
78    # that each entry corresponds to a burst for the specific DRAM
79    # configuration (e.g. x32 with burst length 8 is 32 bytes) and not
80    # the cacheline size or request/packet size
81    write_buffer_size = Param.Unsigned(64, "Number of write queue entries")
82    read_buffer_size = Param.Unsigned(32, "Number of read queue entries")
83
84    # threshold in percent for when to forcefully trigger writes and
85    # start emptying the write buffer
86    write_high_thresh_perc = Param.Percent(85, "Threshold to force writes")
87
88    # threshold in percentage for when to start writes if the read
89    # queue is empty
90    write_low_thresh_perc = Param.Percent(50, "Threshold to start writes")
91
92    # minimum write bursts to schedule before switching back to reads
93    min_writes_per_switch = Param.Unsigned(16, "Minimum write bursts before "
94                                           "switching to reads")
95
96    # scheduler, address map and page policy
97    mem_sched_policy = Param.MemSched('frfcfs', "Memory scheduling policy")
98    addr_mapping = Param.AddrMap('RoRaBaCoCh', "Address mapping policy")
99    page_policy = Param.PageManage('open_adaptive', "Page management policy")
100
101    # enforce a limit on the number of accesses per row
102    max_accesses_per_row = Param.Unsigned(16, "Max accesses per row before "
103                                          "closing");
104
105    # size of DRAM Chip in Bytes
106    device_size = Param.MemorySize("Size of DRAM chip")
107
108    # pipeline latency of the controller and PHY, split into a
109    # frontend part and a backend part, with reads and writes serviced
110    # by the queues only seeing the frontend contribution, and reads
111    # serviced by the memory seeing the sum of the two
112    static_frontend_latency = Param.Latency("10ns", "Static frontend latency")
113    static_backend_latency = Param.Latency("10ns", "Static backend latency")
114
115    # the physical organisation of the DRAM
116    device_bus_width = Param.Unsigned("data bus width in bits for each DRAM "\
117                                      "device/chip")
118    burst_length = Param.Unsigned("Burst lenght (BL) in beats")
119    device_rowbuffer_size = Param.MemorySize("Page (row buffer) size per "\
120                                           "device/chip")
121    devices_per_rank = Param.Unsigned("Number of devices/chips per rank")
122    ranks_per_channel = Param.Unsigned("Number of ranks per channel")
123
124    # default to 0 bank groups per rank, indicating bank group architecture
125    # is not used
126    # update per memory class when bank group architecture is supported
127    bank_groups_per_rank = Param.Unsigned(0, "Number of bank groups per rank")
128    banks_per_rank = Param.Unsigned("Number of banks per rank")
129    # only used for the address mapping as the controller by
130    # construction is a single channel and multiple controllers have
131    # to be instantiated for a multi-channel configuration
132    channels = Param.Unsigned(1, "Number of channels")
133
134    # For power modelling we need to know if the DRAM has a DLL or not
135    dll = Param.Bool(True, "DRAM has DLL or not")
136
137    # DRAMPower provides in addition to the core power, the possibility to
138    # include RD/WR termination and IO power. This calculation assumes some
139    # default values. The integration of DRAMPower with gem5 does not include
140    # IO and RD/WR termination power by default. This might be added as an
141    # additional feature in the future.
142
143    # timing behaviour and constraints - all in nanoseconds
144
145    # the base clock period of the DRAM
146    tCK = Param.Latency("Clock period")
147
148    # the amount of time in nanoseconds from issuing an activate command
149    # to the data being available in the row buffer for a read/write
150    tRCD = Param.Latency("RAS to CAS delay")
151
152    # the time from issuing a read/write command to seeing the actual data
153    tCL = Param.Latency("CAS latency")
154
155    # minimum time between a precharge and subsequent activate
156    tRP = Param.Latency("Row precharge time")
157
158    # minimum time between an activate and a precharge to the same row
159    tRAS = Param.Latency("ACT to PRE delay")
160
161    # minimum time between a write data transfer and a precharge
162    tWR = Param.Latency("Write recovery time")
163
164    # minimum time between a read and precharge command
165    tRTP = Param.Latency("Read to precharge")
166
167    # time to complete a burst transfer, typically the burst length
168    # divided by two due to the DDR bus, but by making it a parameter
169    # it is easier to also evaluate SDR memories like WideIO.
170    # This parameter has to account for burst length.
171    # Read/Write requests with data size larger than one full burst are broken
172    # down into multiple requests in the controller
173    # tBURST is equivalent to the CAS-to-CAS delay (tCCD)
174    # With bank group architectures, tBURST represents the CAS-to-CAS
175    # delay for bursts to different bank groups (tCCD_S)
176    tBURST = Param.Latency("Burst duration (for DDR burst length / 2 cycles)")
177
178    # CAS-to-CAS delay for bursts to the same bank group
179    # only utilized with bank group architectures; set to 0 for default case
180    # tBURST is equivalent to tCCD_S; no explicit parameter required
181    # for CAS-to-CAS delay for bursts to different bank groups
182    tCCD_L = Param.Latency("0ns", "Same bank group CAS to CAS delay")
183
184    # time taken to complete one refresh cycle (N rows in all banks)
185    tRFC = Param.Latency("Refresh cycle time")
186
187    # refresh command interval, how often a "ref" command needs
188    # to be sent. It is 7.8 us for a 64ms refresh requirement
189    tREFI = Param.Latency("Refresh command interval")
190
191    # write-to-read, same rank turnaround penalty
192    tWTR = Param.Latency("Write to read, same rank switching time")
193
194    # read-to-write, same rank turnaround penalty
195    tRTW = Param.Latency("Read to write, same rank switching time")
196
197    # rank-to-rank bus delay penalty
198    # this does not correlate to a memory timing parameter and encompasses:
199    # 1) RD-to-RD, 2) WR-to-WR, 3) RD-to-WR, and 4) WR-to-RD
200    # different rank bus delay
201    tCS = Param.Latency("Rank to rank switching time")
202
203    # minimum row activate to row activate delay time
204    tRRD = Param.Latency("ACT to ACT delay")
205
206    # only utilized with bank group architectures; set to 0 for default case
207    tRRD_L = Param.Latency("0ns", "Same bank group ACT to ACT delay")
208
209    # time window in which a maximum number of activates are allowed
210    # to take place, set to 0 to disable
211    tXAW = Param.Latency("X activation window")
212    activation_limit = Param.Unsigned("Max number of activates in window")
213
214    # time to exit power-down mode
215    # Exit power-down to next valid command delay
216    tXP = Param.Latency("0ns", "Power-up Delay")
217
218    # Exit Powerdown to commands requiring a locked DLL
219    tXPDLL = Param.Latency("0ns", "Power-up Delay with locked DLL")
220
221    # time to exit self-refresh mode
222    tXS = Param.Latency("0ns", "Self-refresh exit latency")
223
224    # time to exit self-refresh mode with locked DLL
225    tXSDLL = Param.Latency("0ns", "Self-refresh exit latency DLL")
226
227    # Currently rolled into other params
228    ######################################################################
229
230    # tRC  - assumed to be tRAS + tRP
231
232    # Power Behaviour and Constraints
233    # DRAMs like LPDDR and WideIO have 2 external voltage domains. These are
234    # defined as VDD and VDD2. Each current is defined for each voltage domain
235    # separately. For example, current IDD0 is active-precharge current for
236    # voltage domain VDD and current IDD02 is active-precharge current for
237    # voltage domain VDD2.
238    # By default all currents are set to 0mA. Users who are only interested in
239    # the performance of DRAMs can leave them at 0.
240
241    # Operating 1 Bank Active-Precharge current
242    IDD0 = Param.Current("0mA", "Active precharge current")
243
244    # Operating 1 Bank Active-Precharge current multiple voltage Range
245    IDD02 = Param.Current("0mA", "Active precharge current VDD2")
246
247    # Precharge Power-down Current: Slow exit
248    IDD2P0 = Param.Current("0mA", "Precharge Powerdown slow")
249
250    # Precharge Power-down Current: Slow exit multiple voltage Range
251    IDD2P02 = Param.Current("0mA", "Precharge Powerdown slow VDD2")
252
253    # Precharge Power-down Current: Fast exit
254    IDD2P1 = Param.Current("0mA", "Precharge Powerdown fast")
255
256    # Precharge Power-down Current: Fast exit multiple voltage Range
257    IDD2P12 = Param.Current("0mA", "Precharge Powerdown fast VDD2")
258
259    # Precharge Standby current
260    IDD2N = Param.Current("0mA", "Precharge Standby current")
261
262    # Precharge Standby current multiple voltage range
263    IDD2N2 = Param.Current("0mA", "Precharge Standby current VDD2")
264
265    # Active Power-down current: slow exit
266    IDD3P0 = Param.Current("0mA", "Active Powerdown slow")
267
268    # Active Power-down current: slow exit multiple voltage range
269    IDD3P02 = Param.Current("0mA", "Active Powerdown slow VDD2")
270
271    # Active Power-down current : fast exit
272    IDD3P1 = Param.Current("0mA", "Active Powerdown fast")
273
274    # Active Power-down current : fast exit multiple voltage range
275    IDD3P12 = Param.Current("0mA", "Active Powerdown fast VDD2")
276
277    # Active Standby current
278    IDD3N = Param.Current("0mA", "Active Standby current")
279
280    # Active Standby current multiple voltage range
281    IDD3N2 = Param.Current("0mA", "Active Standby current VDD2")
282
283    # Burst Read Operating Current
284    IDD4R = Param.Current("0mA", "READ current")
285
286    # Burst Read Operating Current multiple voltage range
287    IDD4R2 = Param.Current("0mA", "READ current VDD2")
288
289    # Burst Write Operating Current
290    IDD4W = Param.Current("0mA", "WRITE current")
291
292    # Burst Write Operating Current multiple voltage range
293    IDD4W2 = Param.Current("0mA", "WRITE current VDD2")
294
295    # Refresh Current
296    IDD5 = Param.Current("0mA", "Refresh current")
297
298    # Refresh Current multiple voltage range
299    IDD52 = Param.Current("0mA", "Refresh current VDD2")
300
301    # Self-Refresh Current
302    IDD6 = Param.Current("0mA", "Self-refresh Current")
303
304    # Self-Refresh Current multiple voltage range
305    IDD62 = Param.Current("0mA", "Self-refresh Current VDD2")
306
307    # Main voltage range of the DRAM
308    VDD = Param.Voltage("0V", "Main Voltage Range")
309
310    # Second voltage range defined by some DRAMs
311    VDD2 = Param.Voltage("0V", "2nd Voltage Range")
312
313# A single DDR3-1600 x64 channel (one command and address bus), with
314# timings based on a DDR3-1600 4 Gbit datasheet (Micron MT41J512M8) in
315# an 8x8 configuration.
316class DDR3_1600_x64(DRAMCtrl):
317    # size of device in bytes
318    device_size = '512MB'
319
320    # 8x8 configuration, 8 devices each with an 8-bit interface
321    device_bus_width = 8
322
323    # DDR3 is a BL8 device
324    burst_length = 8
325
326    # Each device has a page (row buffer) size of 1 Kbyte (1K columns x8)
327    device_rowbuffer_size = '1kB'
328
329    # 8x8 configuration, so 8 devices
330    devices_per_rank = 8
331
332    # Use two ranks
333    ranks_per_channel = 2
334
335    # DDR3 has 8 banks in all configurations
336    banks_per_rank = 8
337
338    # 800 MHz
339    tCK = '1.25ns'
340
341    # 8 beats across an x64 interface translates to 4 clocks @ 800 MHz
342    tBURST = '5ns'
343
344    # DDR3-1600 11-11-11
345    tRCD = '13.75ns'
346    tCL = '13.75ns'
347    tRP = '13.75ns'
348    tRAS = '35ns'
349    tRRD = '6ns'
350    tXAW = '30ns'
351    activation_limit = 4
352    tRFC = '260ns'
353
354    tWR = '15ns'
355
356    # Greater of 4 CK or 7.5 ns
357    tWTR = '7.5ns'
358
359    # Greater of 4 CK or 7.5 ns
360    tRTP = '7.5ns'
361
362    # Default same rank rd-to-wr bus turnaround to 2 CK, @800 MHz = 2.5 ns
363    tRTW = '2.5ns'
364
365    # Default different rank bus delay to 2 CK, @800 MHz = 2.5 ns
366    tCS = '2.5ns'
367
368    # <=85C, half for >85C
369    tREFI = '7.8us'
370
371    # Current values from datasheet
372    IDD0 = '75mA'
373    IDD2N = '50mA'
374    IDD3N = '57mA'
375    IDD4W = '165mA'
376    IDD4R = '187mA'
377    IDD5 = '220mA'
378    VDD = '1.5V'
379
380# A single HMC-2500 x32 model based on:
381# [1] DRAMSpec: a high-level DRAM bank modelling tool
382# developed at the University of Kaiserslautern. This high level tool
383# uses RC (resistance-capacitance) and CV (capacitance-voltage) models to
384# estimate the DRAM bank latency and power numbers.
385# [2] A Logic-base Interconnect for Supporting Near Memory Computation in the
386# Hybrid Memory Cube (E. Azarkhish et. al)
387# Assumed for the HMC model is a 30 nm technology node.
388# The modelled HMC consists of 4 Gbit layers which sum up to 2GB of memory (4
389# layers).
390# Each layer has 16 vaults and each vault consists of 2 banks per layer.
391# In order to be able to use the same controller used for 2D DRAM generations
392# for HMC, the following analogy is done:
393# Channel (DDR) => Vault (HMC)
394# device_size (DDR) => size of a single layer in a vault
395# ranks per channel (DDR) => number of layers
396# banks per rank (DDR) => banks per layer
397# devices per rank (DDR) => devices per layer ( 1 for HMC).
398# The parameters for which no input is available are inherited from the DDR3
399# configuration.
400# This configuration includes the latencies from the DRAM to the logic layer of
401# the HMC
402class HMC_2500_x32(DDR3_1600_x64):
403    # size of device
404    # two banks per device with each bank 4MB [2]
405    device_size = '8MB'
406
407    # 1x32 configuration, 1 device with 32 TSVs [2]
408    device_bus_width = 32
409
410    # HMC is a BL8 device [2]
411    burst_length = 8
412
413    # Each device has a page (row buffer) size of 256 bytes [2]
414    device_rowbuffer_size = '256B'
415
416    # 1x32 configuration, so 1 device [2]
417    devices_per_rank = 1
418
419    # 4 layers so 4 ranks [2]
420    ranks_per_channel = 4
421
422    # HMC has 2 banks per layer [2]
423    # Each layer represents a rank. With 4 layers and 8 banks in total, each
424    # layer has 2 banks; thus 2 banks per rank.
425    banks_per_rank = 2
426
427    # 1250 MHz [2]
428    tCK = '0.8ns'
429
430    # 8 beats across an x32 interface translates to 4 clocks @ 1250 MHz
431    tBURST = '3.2ns'
432
433    # Values using DRAMSpec HMC model [1]
434    tRCD = '10.2ns'
435    tCL = '9.9ns'
436    tRP = '7.7ns'
437    tRAS = '21.6ns'
438
439    # tRRD depends on the power supply network for each vendor.
440    # We assume a tRRD of a double bank approach to be equal to 4 clock
441    # cycles (Assumption)
442    tRRD = '3.2ns'
443
444    # activation limit is set to 0 since there are only 2 banks per vault layer.
445    activation_limit = 0
446
447    # Values using DRAMSpec HMC model [1]
448    tRFC = '59ns'
449    tWR = '8ns'
450    tRTP = '4.9ns'
451
452    # Default different rank bus delay assumed to 1 CK for TSVs, @1250 MHz = 0.8
453    # ns (Assumption)
454    tCS = '0.8ns'
455
456    # Value using DRAMSpec HMC model [1]
457    tREFI = '3.9us'
458
459    # Set default controller parameters
460    page_policy = 'close'
461    write_buffer_size = 8
462    read_buffer_size = 8
463    addr_mapping = 'RoCoRaBaCh'
464    min_writes_per_switch = 8
465
466# A single DDR3-2133 x64 channel refining a selected subset of the
467# options for the DDR-1600 configuration, based on the same DDR3-1600
468# 4 Gbit datasheet (Micron MT41J512M8). Most parameters are kept
469# consistent across the two configurations.
470class DDR3_2133_x64(DDR3_1600_x64):
471    # 1066 MHz
472    tCK = '0.938ns'
473
474    # 8 beats across an x64 interface translates to 4 clocks @ 1066 MHz
475    tBURST = '3.752ns'
476
477    # DDR3-2133 14-14-14
478    tRCD = '13.09ns'
479    tCL = '13.09ns'
480    tRP = '13.09ns'
481    tRAS = '33ns'
482    tRRD = '5ns'
483    tXAW = '25ns'
484
485    # Current values from datasheet
486    IDD0 = '70mA'
487    IDD2N = '37mA'
488    IDD3N = '44mA'
489    IDD4W = '157mA'
490    IDD4R = '191mA'
491    IDD5 = '250mA'
492    VDD = '1.5V'
493
494# A single DDR4-2400 x64 channel (one command and address bus), with
495# timings based on a DDR4-2400 4 Gbit datasheet (Micron MT40A512M8)
496# in an 8x8 configuration.
497class DDR4_2400_x64(DRAMCtrl):
498    # size of device
499    device_size = '512MB'
500
501    # 8x8 configuration, 8 devices each with an 8-bit interface
502    device_bus_width = 8
503
504    # DDR4 is a BL8 device
505    burst_length = 8
506
507    # Each device has a page (row buffer) size of 1 Kbyte (1K columns x8)
508    device_rowbuffer_size = '1kB'
509
510    # 8x8 configuration, so 8 devices
511    devices_per_rank = 8
512
513    # Match our DDR3 configurations which is dual rank
514    ranks_per_channel = 2
515
516    # DDR4 has 2 (x16) or 4 (x4 and x8) bank groups
517    # Set to 4 for x4, x8 case
518    bank_groups_per_rank = 4
519
520    # DDR4 has 16 banks (4 bank groups) in all
521    # configurations. Currently we do not capture the additional
522    # constraints incurred by the bank groups
523    banks_per_rank = 16
524
525    # override the default buffer sizes and go for something larger to
526    # accommodate the larger bank count
527    write_buffer_size = 128
528    read_buffer_size = 64
529
530    # 1200 MHz
531    tCK = '0.833ns'
532
533    # 8 beats across an x64 interface translates to 4 clocks @ 1200 MHz
534    # tBURST is equivalent to the CAS-to-CAS delay (tCCD)
535    # With bank group architectures, tBURST represents the CAS-to-CAS
536    # delay for bursts to different bank groups (tCCD_S)
537    tBURST = '3.333ns'
538
539    # @2400 data rate, tCCD_L is 6 CK
540    # CAS-to-CAS delay for bursts to the same bank group
541    # tBURST is equivalent to tCCD_S; no explicit parameter required
542    # for CAS-to-CAS delay for bursts to different bank groups
543    tCCD_L = '5ns';
544
545    # DDR4-2400 17-17-17
546    tRCD = '14.16ns'
547    tCL = '14.16ns'
548    tRP = '14.16ns'
549    tRAS = '32ns'
550
551    # RRD_S (different bank group) for 1K page is MAX(4 CK, 3.3ns)
552    tRRD = '3.3ns'
553
554    # RRD_L (same bank group) for 1K page is MAX(4 CK, 4.9ns)
555    tRRD_L = '4.9ns';
556
557    tXAW = '21ns'
558    activation_limit = 4
559    tRFC = '350ns'
560
561    tWR = '15ns'
562
563    # Here using the average of WTR_S and WTR_L
564    tWTR = '5ns'
565
566    # Greater of 4 CK or 7.5 ns
567    tRTP = '7.5ns'
568
569    # Default same rank rd-to-wr bus turnaround to 2 CK, @1200 MHz = 1.666 ns
570    tRTW = '1.666ns'
571
572    # Default different rank bus delay to 2 CK, @1200 MHz = 1.666 ns
573    tCS = '1.666ns'
574
575    # <=85C, half for >85C
576    tREFI = '7.8us'
577
578    # Current values from datasheet
579    IDD0 = '64mA'
580    IDD02 = '4mA'
581    IDD2N = '50mA'
582    IDD3N = '67mA'
583    IDD3N2 = '3mA'
584    IDD4W = '180mA'
585    IDD4R = '160mA'
586    IDD5 = '192mA'
587    VDD = '1.2V'
588    VDD2 = '2.5V'
589
590# A single LPDDR2-S4 x32 interface (one command/address bus), with
591# default timings based on a LPDDR2-1066 4 Gbit part (Micron MT42L128M32D1)
592# in a 1x32 configuration.
593class LPDDR2_S4_1066_x32(DRAMCtrl):
594    # No DLL in LPDDR2
595    dll = False
596
597    # size of device
598    device_size = '512MB'
599
600    # 1x32 configuration, 1 device with a 32-bit interface
601    device_bus_width = 32
602
603    # LPDDR2_S4 is a BL4 and BL8 device
604    burst_length = 8
605
606    # Each device has a page (row buffer) size of 1KB
607    # (this depends on the memory density)
608    device_rowbuffer_size = '1kB'
609
610    # 1x32 configuration, so 1 device
611    devices_per_rank = 1
612
613    # Use a single rank
614    ranks_per_channel = 1
615
616    # LPDDR2-S4 has 8 banks in all configurations
617    banks_per_rank = 8
618
619    # 533 MHz
620    tCK = '1.876ns'
621
622    # Fixed at 15 ns
623    tRCD = '15ns'
624
625    # 8 CK read latency, 4 CK write latency @ 533 MHz, 1.876 ns cycle time
626    tCL = '15ns'
627
628    # Pre-charge one bank 15 ns (all banks 18 ns)
629    tRP = '15ns'
630
631    tRAS = '42ns'
632    tWR = '15ns'
633
634    tRTP = '7.5ns'
635
636    # 8 beats across an x32 DDR interface translates to 4 clocks @ 533 MHz.
637    # Note this is a BL8 DDR device.
638    # Requests larger than 32 bytes are broken down into multiple requests
639    # in the controller
640    tBURST = '7.5ns'
641
642    # LPDDR2-S4, 4 Gbit
643    tRFC = '130ns'
644    tREFI = '3.9us'
645
646    # Irrespective of speed grade, tWTR is 7.5 ns
647    tWTR = '7.5ns'
648
649    # Default same rank rd-to-wr bus turnaround to 2 CK, @533 MHz = 3.75 ns
650    tRTW = '3.75ns'
651
652    # Default different rank bus delay to 2 CK, @533 MHz = 3.75 ns
653    tCS = '3.75ns'
654
655    # Activate to activate irrespective of density and speed grade
656    tRRD = '10.0ns'
657
658    # Irrespective of density, tFAW is 50 ns
659    tXAW = '50ns'
660    activation_limit = 4
661
662    # Current values from datasheet
663    IDD0 = '15mA'
664    IDD02 = '70mA'
665    IDD2N = '2mA'
666    IDD2N2 = '30mA'
667    IDD3N = '2.5mA'
668    IDD3N2 = '30mA'
669    IDD4W = '10mA'
670    IDD4W2 = '190mA'
671    IDD4R = '3mA'
672    IDD4R2 = '220mA'
673    IDD5 = '40mA'
674    IDD52 = '150mA'
675    VDD = '1.8V'
676    VDD2 = '1.2V'
677
678# A single WideIO x128 interface (one command and address bus), with
679# default timings based on an estimated WIO-200 8 Gbit part.
680class WideIO_200_x128(DRAMCtrl):
681    # No DLL for WideIO
682    dll = False
683
684    # size of device
685    device_size = '1024MB'
686
687    # 1x128 configuration, 1 device with a 128-bit interface
688    device_bus_width = 128
689
690    # This is a BL4 device
691    burst_length = 4
692
693    # Each device has a page (row buffer) size of 4KB
694    # (this depends on the memory density)
695    device_rowbuffer_size = '4kB'
696
697    # 1x128 configuration, so 1 device
698    devices_per_rank = 1
699
700    # Use one rank for a one-high die stack
701    ranks_per_channel = 1
702
703    # WideIO has 4 banks in all configurations
704    banks_per_rank = 4
705
706    # 200 MHz
707    tCK = '5ns'
708
709    # WIO-200
710    tRCD = '18ns'
711    tCL = '18ns'
712    tRP = '18ns'
713    tRAS = '42ns'
714    tWR = '15ns'
715    # Read to precharge is same as the burst
716    tRTP = '20ns'
717
718    # 4 beats across an x128 SDR interface translates to 4 clocks @ 200 MHz.
719    # Note this is a BL4 SDR device.
720    tBURST = '20ns'
721
722    # WIO 8 Gb
723    tRFC = '210ns'
724
725    # WIO 8 Gb, <=85C, half for >85C
726    tREFI = '3.9us'
727
728    # Greater of 2 CK or 15 ns, 2 CK @ 200 MHz = 10 ns
729    tWTR = '15ns'
730
731    # Default same rank rd-to-wr bus turnaround to 2 CK, @200 MHz = 10 ns
732    tRTW = '10ns'
733
734    # Default different rank bus delay to 2 CK, @200 MHz = 10 ns
735    tCS = '10ns'
736
737    # Activate to activate irrespective of density and speed grade
738    tRRD = '10.0ns'
739
740    # Two instead of four activation window
741    tXAW = '50ns'
742    activation_limit = 2
743
744    # The WideIO specification does not provide current information
745
746# A single LPDDR3 x32 interface (one command/address bus), with
747# default timings based on a LPDDR3-1600 4 Gbit part (Micron
748# EDF8132A1MC) in a 1x32 configuration.
749class LPDDR3_1600_x32(DRAMCtrl):
750    # No DLL for LPDDR3
751    dll = False
752
753    # size of device
754    device_size = '512MB'
755
756    # 1x32 configuration, 1 device with a 32-bit interface
757    device_bus_width = 32
758
759    # LPDDR3 is a BL8 device
760    burst_length = 8
761
762    # Each device has a page (row buffer) size of 4KB
763    device_rowbuffer_size = '4kB'
764
765    # 1x32 configuration, so 1 device
766    devices_per_rank = 1
767
768    # Technically the datasheet is a dual-rank package, but for
769    # comparison with the LPDDR2 config we stick to a single rank
770    ranks_per_channel = 1
771
772    # LPDDR3 has 8 banks in all configurations
773    banks_per_rank = 8
774
775    # 800 MHz
776    tCK = '1.25ns'
777
778    tRCD = '18ns'
779
780    # 12 CK read latency, 6 CK write latency @ 800 MHz, 1.25 ns cycle time
781    tCL = '15ns'
782
783    tRAS = '42ns'
784    tWR = '15ns'
785
786    # Greater of 4 CK or 7.5 ns, 4 CK @ 800 MHz = 5 ns
787    tRTP = '7.5ns'
788
789    # Pre-charge one bank 18 ns (all banks 21 ns)
790    tRP = '18ns'
791
792    # 8 beats across a x32 DDR interface translates to 4 clocks @ 800 MHz.
793    # Note this is a BL8 DDR device.
794    # Requests larger than 32 bytes are broken down into multiple requests
795    # in the controller
796    tBURST = '5ns'
797
798    # LPDDR3, 4 Gb
799    tRFC = '130ns'
800    tREFI = '3.9us'
801
802    # Irrespective of speed grade, tWTR is 7.5 ns
803    tWTR = '7.5ns'
804
805    # Default same rank rd-to-wr bus turnaround to 2 CK, @800 MHz = 2.5 ns
806    tRTW = '2.5ns'
807
808    # Default different rank bus delay to 2 CK, @800 MHz = 2.5 ns
809    tCS = '2.5ns'
810
811    # Activate to activate irrespective of density and speed grade
812    tRRD = '10.0ns'
813
814    # Irrespective of size, tFAW is 50 ns
815    tXAW = '50ns'
816    activation_limit = 4
817
818    # Current values from datasheet
819    IDD0 = '8mA'
820    IDD02 = '60mA'
821    IDD2N = '0.8mA'
822    IDD2N2 = '26mA'
823    IDD3N = '2mA'
824    IDD3N2 = '34mA'
825    IDD4W = '2mA'
826    IDD4W2 = '190mA'
827    IDD4R = '2mA'
828    IDD4R2 = '230mA'
829    IDD5 = '28mA'
830    IDD52 = '150mA'
831    VDD = '1.8V'
832    VDD2 = '1.2V'
833
834# A single GDDR5 x64 interface, with
835# default timings based on a GDDR5-4000 1 Gbit part (SK Hynix
836# H5GQ1H24AFR) in a 2x32 configuration.
837class GDDR5_4000_x64(DRAMCtrl):
838    # size of device
839    device_size = '128MB'
840
841    # 2x32 configuration, 1 device with a 32-bit interface
842    device_bus_width = 32
843
844    # GDDR5 is a BL8 device
845    burst_length = 8
846
847    # Each device has a page (row buffer) size of 2Kbits (256Bytes)
848    device_rowbuffer_size = '256B'
849
850    # 2x32 configuration, so 2 devices
851    devices_per_rank = 2
852
853    # assume single rank
854    ranks_per_channel = 1
855
856    # GDDR5 has 4 bank groups
857    bank_groups_per_rank = 4
858
859    # GDDR5 has 16 banks with 4 bank groups
860    banks_per_rank = 16
861
862    # 1000 MHz
863    tCK = '1ns'
864
865    # 8 beats across an x64 interface translates to 2 clocks @ 1000 MHz
866    # Data bus runs @2000 Mhz => DDR ( data runs at 4000 MHz )
867    # 8 beats at 4000 MHz = 2 beats at 1000 MHz
868    # tBURST is equivalent to the CAS-to-CAS delay (tCCD)
869    # With bank group architectures, tBURST represents the CAS-to-CAS
870    # delay for bursts to different bank groups (tCCD_S)
871    tBURST = '2ns'
872
873    # @1000MHz data rate, tCCD_L is 3 CK
874    # CAS-to-CAS delay for bursts to the same bank group
875    # tBURST is equivalent to tCCD_S; no explicit parameter required
876    # for CAS-to-CAS delay for bursts to different bank groups
877    tCCD_L = '3ns';
878
879    tRCD = '12ns'
880
881    # tCL is not directly found in datasheet and assumed equal tRCD
882    tCL = '12ns'
883
884    tRP = '12ns'
885    tRAS = '28ns'
886
887    # RRD_S (different bank group)
888    # RRD_S is 5.5 ns in datasheet.
889    # rounded to the next multiple of tCK
890    tRRD = '6ns'
891
892    # RRD_L (same bank group)
893    # RRD_L is 5.5 ns in datasheet.
894    # rounded to the next multiple of tCK
895    tRRD_L = '6ns'
896
897    tXAW = '23ns'
898
899    # tXAW < 4 x tRRD.
900    # Therefore, activation limit is set to 0
901    activation_limit = 0
902
903    tRFC = '65ns'
904    tWR = '12ns'
905
906    # Here using the average of WTR_S and WTR_L
907    tWTR = '5ns'
908
909    # Read-to-Precharge 2 CK
910    tRTP = '2ns'
911
912    # Assume 2 cycles
913    tRTW = '2ns'
914
915# A single HBM x128 interface (one command and address bus), with
916# default timings based on data publically released
917# ("HBM: Memory Solution for High Performance Processors", MemCon, 2014),
918# IDD measurement values, and by extrapolating data from other classes.
919# Architecture values based on published HBM spec
920# A 4H stack is defined, 2Gb per die for a total of 1GB of memory.
921class HBM_1000_4H_x128(DRAMCtrl):
922    # HBM gen1 supports up to 8 128-bit physical channels
923    # Configuration defines a single channel, with the capacity
924    # set to (full_ stack_capacity / 8) based on 2Gb dies
925    # To use all 8 channels, set 'channels' parameter to 8 in
926    # system configuration
927
928    # 128-bit interface legacy mode
929    device_bus_width = 128
930
931    # HBM supports BL4 and BL2 (legacy mode only)
932    burst_length = 4
933
934    # size of channel in bytes, 4H stack of 2Gb dies is 1GB per stack;
935    # with 8 channels, 128MB per channel
936    device_size = '128MB'
937
938    device_rowbuffer_size = '2kB'
939
940    # 1x128 configuration
941    devices_per_rank = 1
942
943    # HBM does not have a CS pin; set rank to 1
944    ranks_per_channel = 1
945
946    # HBM has 8 or 16 banks depending on capacity
947    # 2Gb dies have 8 banks
948    banks_per_rank = 8
949
950    # depending on frequency, bank groups may be required
951    # will always have 4 bank groups when enabled
952    # current specifications do not define the minimum frequency for
953    # bank group architecture
954    # setting bank_groups_per_rank to 0 to disable until range is defined
955    bank_groups_per_rank = 0
956
957    # 500 MHz for 1Gbps DDR data rate
958    tCK = '2ns'
959
960    # use values from IDD measurement in JEDEC spec
961    # use tRP value for tRCD and tCL similar to other classes
962    tRP = '15ns'
963    tRCD = '15ns'
964    tCL = '15ns'
965    tRAS = '33ns'
966
967    # BL2 and BL4 supported, default to BL4
968    # DDR @ 500 MHz means 4 * 2ns / 2 = 4ns
969    tBURST = '4ns'
970
971    # value for 2Gb device from JEDEC spec
972    tRFC = '160ns'
973
974    # value for 2Gb device from JEDEC spec
975    tREFI = '3.9us'
976
977    # extrapolate the following from LPDDR configs, using ns values
978    # to minimize burst length, prefetch differences
979    tWR = '18ns'
980    tRTP = '7.5ns'
981    tWTR = '10ns'
982
983    # start with 2 cycles turnaround, similar to other memory classes
984    # could be more with variations across the stack
985    tRTW = '4ns'
986
987    # single rank device, set to 0
988    tCS = '0ns'
989
990    # from MemCon example, tRRD is 4ns with 2ns tCK
991    tRRD = '4ns'
992
993    # from MemCon example, tFAW is 30ns with 2ns tCK
994    tXAW = '30ns'
995    activation_limit = 4
996
997    # 4tCK
998    tXP = '8ns'
999
1000    # start with tRFC + tXP -> 160ns + 8ns = 168ns
1001    tXS = '168ns'
1002
1003# A single HBM x64 interface (one command and address bus), with
1004# default timings based on HBM gen1 and data publically released
1005# A 4H stack is defined, 8Gb per die for a total of 4GB of memory.
1006# Note: This defines a pseudo-channel with a unique controller
1007# instantiated per pseudo-channel
1008# Stay at same IO rate (1Gbps) to maintain timing relationship with
1009# HBM gen1 class (HBM_1000_4H_x128) where possible
1010class HBM_1000_4H_x64(HBM_1000_4H_x128):
1011    # For HBM gen2 with pseudo-channel mode, configure 2X channels.
1012    # Configuration defines a single pseudo channel, with the capacity
1013    # set to (full_ stack_capacity / 16) based on 8Gb dies
1014    # To use all 16 pseudo channels, set 'channels' parameter to 16 in
1015    # system configuration
1016
1017    # 64-bit pseudo-channle interface
1018    device_bus_width = 64
1019
1020    # HBM pseudo-channel only supports BL4
1021    burst_length = 4
1022
1023    # size of channel in bytes, 4H stack of 8Gb dies is 4GB per stack;
1024    # with 16 channels, 256MB per channel
1025    device_size = '256MB'
1026
1027    # page size is halved with pseudo-channel; maintaining the same same number
1028    # of rows per pseudo-channel with 2X banks across 2 channels
1029    device_rowbuffer_size = '1kB'
1030
1031    # HBM has 8 or 16 banks depending on capacity
1032    # Starting with 4Gb dies, 16 banks are defined
1033    banks_per_rank = 16
1034
1035    # reset tRFC for larger, 8Gb device
1036    # use HBM1 4Gb value as a starting point
1037    tRFC = '260ns'
1038
1039    # start with tRFC + tXP -> 160ns + 8ns = 168ns
1040    tXS = '268ns'
1041    # Default different rank bus delay to 2 CK, @1000 MHz = 2 ns
1042    tCS = '2ns'
1043    tREFI = '3.9us'
1044