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README.md

1# DRAM Power Model (DRAMPower)
2[![Build Status](https://travis-ci.org/ravenrd/DRAMPower.svg?branch=master)](https://travis-ci.org/ravenrd/DRAMPower)
3[![Coverage Status](https://coveralls.io/repos/ravenrd/DRAMPower/badge.png?branch=master)](https://coveralls.io/r/ravenrd/DRAMPower?branch=master)
4## 0. Releases
5
6The last official release can be found here:
7https://github.com/ravenrd/DRAMPower/releases/tag/4.0
8
9The master branch of the repository should be regarded as the bleeding-edge version, which has all the latest features, but also all the latest bugs. Use at your own discretion.
10
11## 1. Installation
12
13Clone the repository, or download the zip file of the release you would like to use. The source code is available in src folder. [drampower.cc](src/cli/drampower.cc) file gives the user interface, where the user can specify the memory to be employed and the command/transaction trace to be analyzed. To build, use:
14```bash
15make -j4
16```
17This command will download a set of trace files from https://github.com/Sv3n/DRAMPowerTraces which can be used as test input for the tool.
18
19## 2. Required Packages
20
21The tool was verified on Ubuntu 14.04 using:
22
23 * xerces-c (libxerces-c-dev) - v3.1 with Xerces development package
24 * gcc - v4.4.3
25
26## 3. Directory Structure
27 * src/: contains the source code of the DRAMPower tool that covers the power  model, the command scheduler and the trace analysis tool.
28 * memspecs/   : contains the memory specification XMLs, which give the architectural, timing and current/voltage details for different DRAM memories.
29 * traces/     : contains 4 sample DRAM transaction traces and 1 sample command trace (after the installation / compilation)
30 * test/       : contains test script and reference output
31
32## 4. Trace Specification
33### Command Traces
34If the command-level interface is being used, a command trace can be logged in a file.
35An example is given in ```traces/commands.trace```
36
37The format it uses is: ```<timestamp>,<command>,<bank>```.
38For example, "500,ACT,2", where ACT is the command and 2 is the bank. Timestamp is in clock cycles (cc), the list of supported commands is
39mentioned in [MemCommand.h](src/MemCommand.h) and the bank is the target bank number. For non-bank-specific commands, bank can be set to 0. Rank need not be
40specified. The timing correctness of the trace is not verified by the tool and is assumed to be accurate. However, warning messages are provided, to identify if the memory or bank state is inconsistent in the trace. A sample command trace is provided in the traces/ folder.
41
42### Transaction Traces
43If the transaction-level interface is being used, a transaction trace can be logged.
44
45The format it uses is: ```<timestamp>,<transaction_type>,<address>```.
46For example, "35,READ,0x80028", where READ/WRITE can be the transaction type and the logical address (32-bits long and byte addressable) less than the maximum supported DRAM capacity of 4GB (32Gb).
47
48The tool uses a flexible and efficient memory map as follows: specified in HEX (0x). Timestamp is in clock cycles (cc) and maximum {row}-{bank}-{column}-{BI}-{BC}-{BGI}-{BL}
49Here, BI gives the degree of bank interleaving, BC gives the burst size (count), BGI gives the degree of bank group interleaving (for DDR4) and BL gives the burst length used by the device.
50Dual-Rank addressing is not yet supported. The BC and BL address bits are derived from the column address bits, whereas the BI and BGI bits are derived from the bank address bits.
51
52Four sample MediaBench application transaction traces have been provided. The MediaBench applications include: (1) EPIC Encoder, (2) JPEG Encoder, (3) H263 Encoder and (4) MPEG2 Encoder. These applications were independently executed on the SimpleScalar simulator with a 16KB L1 D-cache, 16KB L1 I-cache, 128KB L2 cache and 64-byte cache line configuration. We filtered out the L2 cache misses meant for the DRAM and logged them as transaction traces. These can be used with our command scheduler to generate equivalent command traces for any DRAM memory specified.
53
54## 5. Usage
55
56[drampower.cc](src/cli/drampower.cc) is the main interface file, which accepts user inputs to specify memory to be employed and the command or transaction trace to be analyzed. If the transaction trace (DRAM command scheduler) is being used, the users can specify the degree of bank interleaving required, the request size and the use of power-down or self-refresh options. Also, for DDR4 memories bank group interleaving can be specified. Dual-rank DRAMs are not yet supported by the command scheduler. Note: Speculative use of power-down or self-refresh modes will increase the trace length due to the power-up latencies of these power-saving modes.
57
58To use DRAMPower at the command-level (command trace), after make, use the following:
59```bash
60./drampower -m <memory spec (ID)> -c <commands trace>
61```
62To use DRAMPower at the transaction-level (command scheduler), after make, use the
63following:
64```bash
65./drampower -m <memory spec (ID)> -t <transactions trace>
66```
67Additional options when using transactions trace [-t] include:
68 * [-i] ```<interleaving>```
69 * [-s] ```<request size>```
70 * [-g] ```<DDR4 bank group interleaving>```
71 * [-p] ```<0 - No Power-Down, 1 - Power-Down, 2 - Self-Refresh>```
72
73Also, when using either the commands trace or the transactions trace, the user can
74optionally include IO and Termination power estimates (obtained from Micron's DRAM
75Power Calculator). To enable the same, the '-r' flag can be employed in command line.
76
77If these options are not used, the default values assumed are:
78* interleaving = 1
79* request size = burst length * I/O width / 8 (in bytes) (from memory XMLs)
80* power saving = No power-down
81* bank group interleaving = 1
82* IO and termination = OFF (0)
83* Burst size (count) of 1
84
85## 6. Memory Specifications
86
8736 sample memory specifications are given in the XMLs targeting DDR2/DDR3/DDR4, LPDDR/LPDDR2/LPDDR3 and WIDE IO DRAM devices. The memory specifications are based on 1Gb DDR2, 1Gb & 2Gb DDR3, 2Gb LPDDR/LPDDR2 and 4Gb DDR4/LPDDR3 Micron datasheets and the 256Mb Wide IO SDR specifications are based on JEDEC timing specifications and circuit-level IDD measurements by TU Kaiserslautern, inplace of the as yet unavailable vendor datasheets. 4 of the memory specifications target dual-rank DDR3 DIMMs.
88
89Note: The timing specifications in the XMLs are in clock cycles (cc). The current specifications for Reading and Writing do not include the I/O consumption. They are computed and included seperately based on Micron Power Calculator. The IDD measures associated with different power supply sources of equal measure (VDD2, VDDCA and VDDQ) for LPDDR2, LPDDR3, DDR4 and WIDE IO memories have been added up together for simplicity, since it does not impact power computation accuracy. The current measures for dual-rank DIMMs reflect only the measures for the active rank. The default state of the idle rank is assumed to be the same as the complete memory state, for background power estimation. Accordingly, in all dual-rank memory specifications, IDD2P0 has been subtracted from the active currents and all background currents have been halved. They are also accounted for seperately by the power model. Stacking multiple Wide IO DRAM dies can also be captured by the nbrOfRanks parameter.
90
91## 7. Variation-aware Power And Energy Estimation
92
9315 of the included datasheets reflect the impact of process-variations on DRAM currents for a selection of DDR3 memories manufactured at 50nm process technology. These memories include:
94(1) MICRON_128MB_DDR3-1066_8bit - revision G
95(2) MICRON_128MB_DDR3-1066_16bit - revision G
96(3) MICRON_128MB_DDR3-1600_8bit - revision G
97(4) MICRON_256MB_DDR3-1066_8bit - revision D
98(5) MICRON_256MB_DDR3-1600_16bit - revision D
99
100The original vendor-provided datasheet current specifications are given in XMLs
101without suffixes such as _mu, _2s and _3s. XMLs including suffixes indicate that the
102current measures are either: (1) typical (mu), or (2) include +2 sigma variation (2s),
103or (3) include +3 sigma variation (3s). These measures are derived based on the
104Monte-Carlo analysis performed on our SPICE-based DRAM cross-section.
105
106To include these XMLs in your simulations, simply use them as the target memory.
107
108## 8. Example Usage
109
110An example of using this tool is provided below. To compile the example,
111use the Makefile and make sure the gcc and Xerces-c are installed. Then, run:
112```
113make -j4
114```
115After this, run with the command trace or the transaction trace, as described before:
116```
117./drampower -m memspecs/MICRON_1Gb_DDR3-1066_8bit_G.xml -t traces/mediabench-epic.trace -r
118```
119The output should be something like this:
120
121```
122* Parsing memspecs/MICRON_1Gb_DDR3-1066_8bit_G.xml
123* Analysis start time: Thu Aug  4 15:43:52 2016
124* Analyzing the input trace
125* Trace Details:
126
127#ACT commands: 96984
128#RD + #RDA commands: 67179
129#WR + #WRA commands: 29805
130#PRE (+ PREA) commands: 96984
131#REF commands: 13168
132#Active Cycles: 2519793
133  #Active Idle Cycles: 196851
134  #Active Power-Up Cycles: 0
135    #Auto-Refresh Active cycles during Self-Refresh Power-Up: 0
136#Precharged Cycles: 52261474
137  #Precharged Idle Cycles: 51649629
138  #Precharged Power-Up Cycles: 0
139    #Auto-Refresh Precharged cycles during Self-Refresh Power-Up: 0
140  #Self-Refresh Power-Up Cycles: 0
141Total Idle Cycles (Active + Precharged): 51846480
142#Power-Downs: 0
143  #Active Fast-exit Power-Downs: 0
144  #Active Slow-exit Power-Downs: 0
145  #Precharged Fast-exit Power-Downs: 0
146  #Precharged Slow-exit Power-Downs: 0
147#Power-Down Cycles: 0
148  #Active Fast-exit Power-Down Cycles: 0
149  #Active Slow-exit Power-Down Cycles: 0
150    #Auto-Refresh Active cycles during Self-Refresh: 0
151  #Precharged Fast-exit Power-Down Cycles: 0
152  #Precharged Slow-exit Power-Down Cycles: 0
153    #Auto-Refresh Precharged cycles during Self-Refresh: 0
154#Auto-Refresh Cycles: 776912
155#Self-Refreshes: 0
156#Self-Refresh Cycles: 0
157----------------------------------------
158Total Trace Length (clock cycles): 54781267
159----------------------------------------
160
161* Trace Power and Energy Estimates:
162
163ACT Cmd Energy: 109175234.52 pJ
164PRE Cmd Energy: 47764165.10 pJ
165RD Cmd Energy: 49155365.85 pJ
166WR Cmd Energy: 23486116.32 pJRD I/O Energy: 20872124.58 pJ
167WR Termination Energy: 47419587.24 pJ
168ACT Stdby Energy: 283653996.25 pJ
169  Active Idle Energy: 22159587.24 pJ
170  Active Power-Up Energy: 0.00 pJ
171    Active Stdby Energy during Auto-Refresh cycles in Self-Refresh Power-Up: 0.00 pJ
172PRE Stdby Energy: 5147706163.23 pJ
173  Precharge Idle Energy: 5087440004.69 pJ
174  Precharged Power-Up Energy: 0.00 pJ
175    Precharge Stdby Energy during Auto-Refresh cycles in Self-Refresh Power-Up: 0.00 pJ
176  Self-Refresh Power-Up Energy: 0.00 pJ
177Total Idle Energy (Active + Precharged): 5109599591.93 pJ
178Total Power-Down Energy: 0.00 pJ
179  Fast-Exit Active Power-Down Energy: 0.00 pJ
180  Slow-Exit Active Power-Down Energy: 0.00 pJ
181    Slow-Exit Active Power-Down Energy during Auto-Refresh cycles in Self-Refresh: 0.00 pJ
182  Fast-Exit Precharged Power-Down Energy: 0.00 pJ
183  Slow-Exit Precharged Power-Down Energy: 0.00 pJ
184    Slow-Exit Precharged Power-Down Energy during Auto-Refresh cycles in Self-Refresh: 0.00 pJ
185Auto-Refresh Energy: 262371782.36 pJ
186Self-Refresh Energy: 0.00 pJ
187----------------------------------------
188Total Trace Energy: 5991604535.46 pJ
189Average Power: 58.30 mW
190----------------------------------------
191* Power Computation End time: Thu Aug  4 15:43:59 2016
192* Total Simulation time: 7 seconds
193*
194```
195
196As can be noticed, the tool performs DRAM command scheduling and reports the number
197of activates, precharges, reads, writes, refreshes, power-downs and self-refreshes
198besides the number of clock cycles spent in the active and precharged states, in the
199power-down (fast/slow-exit) and self-refresh states and in the idle mode. It also
200reports the energy consumption of these components, besides the IO and Termination
201components in pJ (pico Joules) and the average power consumption of the trace in mW.
202It also reports the simulation start/end times and the total simulation time in seconds.
203
204## 9. DRAMPower Library
205
206The DRAMPower tool has an additional feature and can be used as a library.
207In order to use the library run "make lib", include [LibDRAMPower.h](src/libdrampower/LibDRAMPower.h) in your project and
208link the file src/libdrampower.a with your project.
209Examples for the usage of the library are [lib_test.cc](test/libdrampowertest/lib_test.cc) and [window_example.cc](test/libdrampowertest/window_example.cc).
210
211## 10. Authors & Acknowledgment
212
213The tool is based on the DRAM power model developed jointly by the Computer Engineering Research Group at TU Delft and the Electronic Systems Group at TU Eindhoven
214and verified by the Microelectronic System Design Research Group at TU Kaiserslautern with equivalent circuit-level simulations. This tool has been developed by
215Karthik Chandrasekar with Yonghui Li under the supervision of Dr. Benny Akesson and Prof. Kees Goossens. The IO and Termination Power measures have been employed
216from Micron's DRAM Power Calculator. If you decide to use DRAMPower in your research, please cite one of the following references:
217
218**To cite the DRAMPower Tool:**
219```
220[1] DRAMPower: Open-source DRAM Power & Energy Estimation Tool
221Karthik Chandrasekar, Christian Weis, Yonghui Li, Sven Goossens, Matthias Jung, Omar Naji, Benny Akesson, Norbert Wehn, and Kees Goossens
222URL: http://www.drampower.info
223```
224
225**To cite the DRAM power model:**
226```
227[2] "Improved Power Modeling of DDR SDRAMs"
228Karthik Chandrasekar, Benny Akesson, and Kees Goossens
229In Proc. 14th Euromicro Conference on Digital System Design (DSD), 2011
230```
231
232**To cite the 3D-DRAM power model:**
233```
234[3] "System and Circuit Level Power Modeling of Energy-Efficient 3D-Stacked Wide I/O DRAMs"
235Karthik Chandrasekar, Christian Weis, Benny Akesson, Norbert Wehn, and Kees Goossens
236In Proc. Design, Automation and Test in Europe (DATE), 2013
237```
238
239**To cite variation-aware DRAM power estimation:**
240```
241[4] "Towards Variation-Aware System-Level Power Estimation of DRAMs: An Empirical Approach"
242Karthik Chandrasekar, Christian Weis, Benny Akesson, Norbert Wehn, and Kees Goossens
243In Proc. Design Automation Conference (DAC), 2013
244```
245
246## 11. Contact Information
247
248Further questions about the tool and the power model can be directed to:
249
250Benny Akesson (k.b.akesson@tue.nl)
251
252Feel free to ask for updates to the tool's features and please do report any bugs
253and errors you encounter. This will encourage us to continuously improve the tool.
254
255## Disclaimer
256
257The tool does not check the timing accuracy of the user's memory command trace
258and the use of commands and memory modes. It is expected that the user employs
259a valid trace generated using a DRAM memory controller or simulator, which
260satisfies all memory timing constraints and other requirements. The user DOES
261NOT get ANY WARRANTIES when using this tool. This software is released under the
262BSD 3-Clause License. By using this software, the user implicitly agrees to the
263licensing terms.
264